DS3030W-100 vs DS2030L-100# feature comparison

DS3030W-100 Maxim Integrated Products

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DS2030L-100# Maxim Integrated Products

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC MAXIM INTEGRATED PRODUCTS INC
Part Package Code BGA BGA
Package Description 27 X 27 MM, MODULE, BGA-256 27 X 27 MM, ROHS COMPLIANT, BGA-256
Pin Count 256 256
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 100 ns 100 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e1
Length 27 mm 27 mm
Memory Density 262144 bit 262144 bit
Memory IC Type NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 256 256
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 8.72 mm 8.72 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 27 mm
Base Number Matches 1 2
Factory Lead Time 4 Weeks
Package Equivalence Code BGA256,20X20,50
Standby Current-Max 0.001 A
Supply Current-Max 0.05 mA

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Compare DS2030L-100# with alternatives