DS2788E+
vs
MAX17044X+T10
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
TSSOP
|
BGA
|
| Package Description |
TSSOP, TSSOP14,.25
|
VFBGA, BGA9,3X3,16
|
| Pin Count |
14
|
9
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Adjustable Threshold |
NO
|
NO
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY MANAGEMENT CIRCUIT
|
| JESD-30 Code |
R-PDSO-G14
|
R-PBGA-B9
|
| JESD-609 Code |
e3
|
e2
|
| Length |
5 mm
|
1.595 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
9
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
VFBGA
|
| Package Equivalence Code |
TSSOP14,.25
|
BGA9,3X3,16
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
0.69 mm
|
| Supply Current-Max (Isup) |
0.105 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
4.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
3.8 V
|
3.6 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER NICKEL
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
4.4 mm
|
1.415 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare DS2788E+ with alternatives
Compare MAX17044X+T10 with alternatives