DS2775G+
vs
DS2775G+
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ANALOG DEVICES INC
|
| Part Package Code |
DFN
|
14-LFCSP-3X5X0.8
|
| Package Description |
TDFN-14
|
TDFN-14
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
R-XDSO-N14
|
R-XDSO-N14
|
| JESD-609 Code |
e4
|
e4
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC14,.2,16
|
SOLCC14,.2,16
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Current-Max (Isup) |
0.3 mA
|
0.3 mA
|
| Supply Voltage-Max (Vsup) |
9.2 V
|
9.2 V
|
| Supply Voltage-Min (Vsup) |
4 V
|
4 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
2
|
| Manufacturer Package Code |
|
14-LFCSP-3X5X0.8
|
| Date Of Intro |
|
2008-11-07
|
| Samacsys Manufacturer |
|
Analog Devices
|
|
|
|
Compare DS2775G+ with alternatives
Compare DS2775G+ with alternatives