DS26514GN
vs
DS26519G
feature comparison
All Stats
Differences Only
Pbfree Code
No
No
Rohs Code
No
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
BGA
BGA
Package Description
BGA, BGA256,16X16,40
23 X 23 MM, 1 MM PITCH, HSBGA-484
Pin Count
256
484
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Carrier Type
CEPT PCM-30/E-1
CEPT PCM-30/E-1
Carrier Type (2)
T-1(DS1)
JESD-30 Code
S-PBGA-B256
S-PBGA-B484
Length
17 mm
23 mm
Moisture Sensitivity Level
3
3
Number of Functions
1
1
Number of Terminals
256
484
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA484,22X22,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.76 mm
2.41 mm
Supply Current-Max
0.25 mA
925 mA
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Telecom IC Type
FRAMER
FRAMER
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
23 mm
Base Number Matches
2
1
JESD-609 Code
e0
Peak Reflow Temperature (Cel)
245
Terminal Finish
TIN LEAD
Compare DS26514GN with alternatives
Compare DS26519G with alternatives