DS2506S-UNW
vs
XC17256ELVO8C
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
DALLAS SEMICONDUCTOR
ROCHESTER ELECTRONICS LLC
Package Description
SOP,
PLASTIC, TSOP-8
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDSO-G8
R-PDSO-G8
Memory Density
65536 bit
262144 bit
Memory IC Type
OTP ROM
CONFIGURATION MEMORY
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
65536 words
262144 words
Number of Words Code
64000
256000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
64KX1
256KX1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSOP2
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
COMMERCIAL
Supply Voltage-Max (Vsup)
6 V
3.6 V
Supply Voltage-Min (Vsup)
2.8 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Pbfree Code
Rohs Code
Part Package Code
TSOP
Pin Count
8
Additional Feature
USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
JESD-609 Code
e0
Length
4.9276 mm
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
225
Seated Height-Max
1.1938 mm
Supply Voltage-Nom (Vsup)
3.3 V
Terminal Finish
TIN LEAD
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
3.937 mm