DS2506S+ vs XC17256LVO8I feature comparison

DS2506S+ Analog Devices Inc

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XC17256LVO8I AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Not Recommended Obsolete
Part Package Code 8-SOIC_W-300_MIL TSOP
Pin Count 8 8
Manufacturer Package Code 8-SOIC_W-300_MIL
Date Of Intro 2000-06-27
Samacsys Manufacturer Analog Devices
I/O Type COMMON COMMON
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e3 e0
Length 5.31 mm 4.9276 mm
Memory Density 65536 bit 262144 bit
Memory IC Type OTP ROM CONFIGURATION MEMORY
Memory Width 1 1
Moisture Sensitivity Level 1 3
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 65536 words 262144 words
Number of Words Code 64000 256000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 64KX1 256KX1
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP TSOP2
Package Equivalence Code SOP8,.3 TSOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) 260 225
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.13 mm 1.1938 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2.8 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology MOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 5.285 mm 3.937 mm
Base Number Matches 1 2
Ihs Manufacturer XILINX INC
Package Description PLASTIC, TSOP-8
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 10 MHz
Output Characteristics 3-STATE
Standby Current-Max 0.00005 A
Supply Current-Max 0.005 mA

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