DS2502P-E64+
vs
DS2502P-E48+
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
TSOC-6
|
SOC, SOC6,.17
|
Pin Count |
6
|
6
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
JESD-30 Code |
R-PDSO-C6
|
R-PDSO-C6
|
JESD-609 Code |
e3
|
e3
|
Length |
3.94 mm
|
3.94 mm
|
Memory Density |
1024 bit
|
1024 bit
|
Memory IC Type |
OTP ROM
|
OTP ROM
|
Memory Width |
1
|
1
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
6
|
6
|
Number of Words |
1024 words
|
1024 words
|
Number of Words Code |
1000
|
1000
|
Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
1KX1
|
1KX1
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LSOC
|
SOC
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, LOW PROFILE
|
SMALL OUTLINE
|
Parallel/Serial |
SERIAL
|
SERIAL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.5 mm
|
1.5 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2.8 V
|
2.8 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
MOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
C BEND
|
C BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
3.76 mm
|
3.76 mm
|
Base Number Matches |
2
|
2
|
I/O Type |
|
COMMON
|
Package Equivalence Code |
|
SOC6,.17
|
Standby Current-Max |
|
0.000005 A
|
Supply Current-Max |
|
0.000005 mA
|
|
|
|
Compare DS2502P-E64+ with alternatives
Compare DS2502P-E48+ with alternatives