DS2502-E64
vs
DS2502/T&R/SL
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
TO-92
|
TO-92
|
| Package Description |
TO-92,
|
, SIP3,.1,50
|
| Pin Count |
3
|
3
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| JESD-30 Code |
O-PBCY-T3
|
O-PBCY-T3
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
1024 bit
|
1024 bit
|
| Memory IC Type |
OTP ROM
|
OTP ROM
|
| Memory Width |
1
|
8
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Number of Words |
1024 words
|
128 words
|
| Number of Words Code |
1000
|
128
|
| Operating Mode |
SYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
1KX1
|
128X8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TO-92
|
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
CYLINDRICAL
|
CYLINDRICAL
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2.8 V
|
2.8 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
MOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Base Number Matches |
3
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.71
|
| Access Time-Max |
|
15000 ns
|
| Additional Feature |
|
MICROLAN COMPATIBLE
|
| I/O Type |
|
COMMON
|
| Package Equivalence Code |
|
SIP3,.1,50
|
| Terminal Pitch |
|
1.27 mm
|
|
|
|
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