DS2430AX
vs
11LC020T-E/MNY
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
CSP
|
DFN
|
| Package Description |
FCP-4
|
2 X 3 MM, 0.75 MM HEIGHT, ROHS COMPLIANT, PLASTIC, TDFN-8
|
| Pin Count |
2
|
8
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Additional Feature |
MICROLAN COMPATIBLE
|
|
| Endurance |
100000 Write/Erase Cycles
|
1000000 Write/Erase Cycles
|
| JESD-30 Code |
R-PBGA-B4
|
R-PDSO-N8
|
| JESD-609 Code |
e0
|
e4
|
| Length |
2.39 mm
|
3 mm
|
| Memory Density |
256 bit
|
2048 bit
|
| Memory IC Type |
EEPROM
|
EEPROM
|
| Memory Width |
1
|
8
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
4
|
8
|
| Number of Words |
256 words
|
256 words
|
| Number of Words Code |
256
|
256
|
| Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
256X1
|
256X8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
HVSON
|
| Package Equivalence Code |
BGA4(UNSPEC)
|
SOLCC8,.12,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Parallel/Serial |
SERIAL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.596 mm
|
0.8 mm
|
| Serial Bus Type |
1-WIRE
|
1-WIRE
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.8 V
|
2.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Width |
1.73 mm
|
2 mm
|
| Base Number Matches |
5
|
1
|
| Pbfree Code |
|
Yes
|
| Factory Lead Time |
|
14 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Clock Frequency-Max (fCLK) |
|
1 MHz
|
| Data Retention Time-Min |
|
200
|
| Number of Ports |
|
1
|
| Output Characteristics |
|
TOTEM POLE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Ready/Busy |
|
NO
|
| Reverse Pinout |
|
NO
|
| Screening Level |
|
AEC-Q100
|
| Standby Current-Max |
|
0.000005 A
|
| Supply Current-Max |
|
0.005 mA
|
| Terminal Pitch |
|
0.5 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Toggle Bit |
|
NO
|
| Write Cycle Time-Max (tWC) |
|
10 ms
|
| Write Protection |
|
SOFTWARE
|
|
|
|
Compare DS2430AX with alternatives
Compare 11LC020T-E/MNY with alternatives