DS2423P
vs
DS2423P/T&R
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
DALLAS SEMICONDUCTOR
Part Package Code
SOIC
Package Description
3.70 X 4 MM, 1.50 MM HEIGHT, TSOC-6
TSOC-6
Pin Count
6
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
15000 ns
Additional Feature
ALSO CONTAINS 64 BIT LASERED ROM
I/O Type
COMMON
JESD-30 Code
R-PDSO-C6
R-PDSO-C6
JESD-609 Code
e0
Length
3.94 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
MEMORY CIRCUIT
MEMORY CIRCUIT
Memory Width
1
1
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Ports
1, (1 LINE)
Number of Terminals
6
6
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
4KX1
4KX1
Output Characteristics
OPEN-DRAIN
OPEN-DRAIN
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOC
SOC
Package Equivalence Code
SOC6,.17
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Parallel/Serial
SERIAL
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2.8 V
2.8 V
Supply Voltage-Nom (Vsup)
3 V
5 V
Surface Mount
YES
YES
Technology
MOS
MOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
C BEND
C BEND
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
3.76 mm
Base Number Matches
2
2
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