DS21FT44N
vs
PEF22557E
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
DALLAS SEMICONDUCTOR
|
INFINEON TECHNOLOGIES AG
|
| Package Description |
27 X 27 MM, BGA-300
|
LBGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
S-PBGA-B300
|
S-PBGA-B256
|
| JESD-609 Code |
e0
|
|
| Number of Functions |
12
|
1
|
| Number of Terminals |
300
|
256
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LBGA
|
| Package Equivalence Code |
BGA300,20X20,50
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
3.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
FRAMER
|
FRAMER
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
256
|
| HTS Code |
|
8542.39.00.01
|
| Length |
|
17 mm
|
| Seated Height-Max |
|
1.5 mm
|
| Supply Current-Max |
|
350 mA
|
| Width |
|
17 mm
|
|
|
|
Compare PEF22557E with alternatives