DS2182QN/T&R
vs
TSS933EASB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
TEMIC SEMICONDUCTORS
Part Package Code
QLCC
Package Description
QCCJ,
MQFPJ-28
Pin Count
28
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.39.00.01
JESD-30 Code
S-PQCC-J28
S-XQFP-G28
JESD-609 Code
e0
Length
11.505 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
28
28
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
QCCJ
QFP
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
BICMOS
Telecom IC Type
FRAMER
FRAMER
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
J BEND
GULL WING
Terminal Pitch
1.27 mm
Terminal Position
QUAD
QUAD
Width
11.505 mm
Base Number Matches
1
1
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Compare TSS933EASB with alternatives