DS2180A
vs
MH89770S
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ZARLINK SEMICONDUCTOR INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
SOP, GWDIP40,.9
|
| Pin Count |
40
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-PDIP-T40
|
R-PDSO-G40
|
| JESD-609 Code |
e0
|
e0
|
| Length |
52.3875 mm
|
50.8 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
4.064 mm
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
FRAMER
|
FRAMER
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
15.24 mm
|
|
| Base Number Matches |
3
|
2
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
GWDIP40,.9
|
| Supply Current-Max |
|
25 mA
|
|
|
|
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