DS2151QNB
vs
MT8979AP
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
MICROSEMI CORP
Part Package Code
LCC
LPCC
Package Description
QCCJ,
Pin Count
44
44
Reach Compliance Code
unknown
unknown
JESD-30 Code
S-PQCC-J44
S-PQCC-J44
JESD-609 Code
e0
Length
16.585 mm
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Terminals
44
44
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Peak Reflow Temperature (Cel)
240
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
4.572 mm
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Telecom IC Type
FRAMER
FRAMER
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
20
Width
16.585 mm
Base Number Matches
3
2
HTS Code
8542.39.00.01
Package Equivalence Code
LDCC44,.7SQ
Supply Current-Max
16 mA