DS2141AQ+ vs MT8979AP feature comparison

DS2141AQ+ Maxim Integrated Products

Buy Now Datasheet

MT8979AP Microsemi Corporation

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC MICROSEMI CORP
Part Package Code LCC LPCC
Package Description QCCJ,
Pin Count 44 44
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.31.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
JESD-30 Code S-PQCC-J44 S-PQCC-J44
JESD-609 Code e3
Length 16.585 mm
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 44 44
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Telecom IC Type FRAMER FRAMER
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 16.585 mm
Base Number Matches 1 2
Package Equivalence Code LDCC44,.7SQ
Supply Current-Max 16 mA

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