DS2045W-100#
vs
DS2045AB-100
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
BGA
BGA
Package Description
27 X 27 MM, ROHS COMPLIANT, PLASTIC, BGA-256
BGA,
Pin Count
256
256
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
100 ns
100 ns
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
27 mm
27 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
NON-VOLATILE SRAM MODULE
NON-VOLATILE SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
256
256
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128KX8
128KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,20X20,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
8.72 mm
8.72 mm
Standby Current-Max
0.005 A
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
3.6 V
5.25 V
Supply Voltage-Min (Vsup)
3 V
4.75 V
Supply Voltage-Nom (Vsup)
3.3 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
27 mm
27 mm
Base Number Matches
1
1
JESD-609 Code
e0
Terminal Finish
TIN LEAD
Compare DS2045W-100# with alternatives
Compare DS2045AB-100 with alternatives