DS1330YP-70
vs
DS1330YP-70IND
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
POWERCAP MODULE-34
|
, MODULE,34LEAD,1.0
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| Access Time-Max |
70 ns
|
70 ns
|
| Additional Feature |
10 YEARS MINIMUM DATA RETENTION
|
|
| JESD-30 Code |
R-XDMA-U34
|
R-XDMA-U34
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
NON-VOLATILE SRAM MODULE
|
NON-VOLATILE SRAM MODULE
|
| Memory Width |
8
|
8
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
34
|
34
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
32KX8
|
32KX8
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Equivalence Code |
MODULE,34LEAD,1.0
|
MODULE,34LEAD,1.0
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.00015 A
|
0.00015 A
|
| Supply Current-Max |
0.085 mA
|
0.085 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
MOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
J INVERTED
|
J INVERTED
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
4
|
2
|
| Part Package Code |
|
DMA
|
| Pin Count |
|
34
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8473.30.11.40
|
|
|
|
Compare DS1330YP-70 with alternatives
Compare DS1330YP-70IND with alternatives