DS1265Y-70
vs
EDI9F81025LP85BPI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
WHITE ELECTRONIC DESIGNS CORP
Part Package Code
DIP
Package Description
DIP, DIP36,.6
Pin Count
36
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.B.2.A
HTS Code
8473.30.11.40
Factory Lead Time
4 Weeks
Access Time-Max
70 ns
85 ns
Additional Feature
10 YEAR DATA RETENTION PERIOD
TTL COMPATIBLE INPUTS/OUTPUTS
JESD-30 Code
R-XDMA-P36
R-PDMA-U36
JESD-609 Code
e0
Length
53.085 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
NON-VOLATILE SRAM MODULE
SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
36
36
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1MX8
1MX8
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIP
Package Equivalence Code
DIP36,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
10.29 mm
Standby Current-Max
0.00015 A
Supply Current-Max
0.085 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
PIN/PEG
J INVERTED
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
4
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare DS1265Y-70 with alternatives
Compare EDI9F81025LP85BPI with alternatives