DS1265AB-70IND
vs
DS1265AB-100
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
parentfamilyid
1232912
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
ROCHESTER ELECTRONICS LLC
Part Package Code
MODULE
MODULE
Package Description
0.740 INCH, DIP-36
0.740 INCH, DIP-36
Pin Count
36
36
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.B.2.A
HTS Code
8473.30.11.40
Category CO2 Kg
12
12
Compliance Temperature Grade
Industrial: -40C to +85C
Candidate List Date
2010-12-15
Access Time-Max
70 ns
100 ns
JESD-30 Code
R-XDMA-P36
R-XDMA-P36
JESD-609 Code
e0
e0
Memory Density
8388608 bit
8388608 bit
Memory IC Type
NON-VOLATILE SRAM MODULE
NON-VOLATILE SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
36
36
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
1MX8
1MX8
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIP
DIP
Package Equivalence Code
DIP36,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
COMMERCIAL
Standby Current-Max
0.00015 A
Supply Current-Max
0.085 mA
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
3
Pbfree Code
Additional Feature
10 YEAR DATA RETENTION PERIOD
Length
53.085 mm
Moisture Sensitivity Level
NOT SPECIFIED
Peak Reflow Temperature (Cel)
240
Seated Height-Max
10.29 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
Compare DS1265AB-70IND with alternatives