DS1265AB-100
vs
DS1265AB-70
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
ROCHESTER ELECTRONICS LLC
Part Package Code
MODULE
MODULE
Package Description
0.740 INCH, DIP-36
0.740 INCH, DIP-36
Pin Count
36
36
Reach Compliance Code
unknown
unknown
Access Time-Max
100 ns
70 ns
Additional Feature
10 YEAR DATA RETENTION PERIOD
10 YEAR DATA RETENTION PERIOD
JESD-30 Code
R-XDMA-P36
R-XDMA-P36
JESD-609 Code
e0
e0
Length
53.085 mm
53.085 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
NON-VOLATILE SRAM MODULE
NON-VOLATILE SRAM MODULE
Memory Width
8
8
Moisture Sensitivity Level
NOT SPECIFIED
NOT SPECIFIED
Number of Functions
1
1
Number of Terminals
36
36
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX8
1MX8
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
240
Qualification Status
COMMERCIAL
COMMERCIAL
Seated Height-Max
10.29 mm
10.29 mm
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
15.24 mm
15.24 mm
Base Number Matches
3
3