DS1258W-100IND
vs
DS1258AB-70#
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
DMA
|
DMA
|
| Package Description |
,
|
0.740 INCH, DIP-40
|
| Pin Count |
40
|
40
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
100 ns
|
70 ns
|
| JESD-30 Code |
R-XDMA-P40
|
R-XDMA-P40
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
2097152 bit
|
2097152 bit
|
| Memory IC Type |
NON-VOLATILE SRAM MODULE
|
NON-VOLATILE SRAM MODULE
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
40
|
40
|
| Number of Words |
131072 words
|
131072 words
|
| Number of Words Code |
128000
|
128000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
128KX16
|
128KX16
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
PIN/PEG
|
PIN/PEG
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
4
|
| Pbfree Code |
|
No
|
| Additional Feature |
|
10 YEAR DATA RETENTION
|
| Package Code |
|
DIP
|
| Package Equivalence Code |
|
DIP40,.6
|
| Standby Current-Max |
|
0.01 A
|
| Supply Current-Max |
|
0.17 mA
|
| Terminal Pitch |
|
2.54 mm
|
|
|
|
Compare DS1258W-100IND with alternatives
Compare DS1258AB-70# with alternatives