DS1230W-100-IND
vs
UT7156C-55PCC
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
AEROFLEX COLORADO SPRINGS
|
Part Package Code |
MODULE
|
DIP
|
Package Description |
,
|
DIP,
|
Pin Count |
28
|
28
|
Reach Compliance Code |
compliant
|
unknown
|
Access Time-Max |
100 ns
|
55 ns
|
JESD-30 Code |
R-XDMA-T28
|
R-CDIP-T28
|
JESD-609 Code |
e0
|
|
Memory Density |
262144 bit
|
262144 bit
|
Memory IC Type |
NON-VOLATILE SRAM MODULE
|
STANDARD SRAM
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Number of Words |
32768 words
|
32768 words
|
Number of Words Code |
32000
|
32000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Organization |
32KX8
|
32KX8
|
Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
IN-LINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Base Number Matches |
3
|
1
|
ECCN Code |
|
3A001.A.2.C
|
HTS Code |
|
8542.32.00.41
|
Length |
|
35.56 mm
|
Package Code |
|
DIP
|
Seated Height-Max |
|
4.445 mm
|
Terminal Pitch |
|
2.54 mm
|
Total Dose |
|
1M Rad(Si) V
|
Width |
|
15.24 mm
|
|
|
|
Compare DS1230W-100-IND with alternatives
Compare UT7156C-55PCC with alternatives