DS1230W-100-IND vs U631H256D1K35G1 feature comparison

DS1230W-100-IND Maxim Integrated Products

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U631H256D1K35G1 ZMDI

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MAXIM INTEGRATED PRODUCTS INC ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code MODULE DIP
Package Description , DIP, DIP28,.6
Pin Count 28 28
Reach Compliance Code compliant compliant
Access Time-Max 100 ns 35 ns
JESD-30 Code R-XDMA-T28 R-PDIP-T28
JESD-609 Code e0 e3
Memory Density 262144 bit 262144 bit
Memory IC Type NON-VOLATILE SRAM MODULE NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 4.5 V
Supply Voltage-Nom (Vsup) 3.3 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Number Matches 3 1
Pbfree Code Yes
ECCN Code EAR99
HTS Code 8542.32.00.41
Length 37.1 mm
Moisture Sensitivity Level 3
Package Code DIP
Package Equivalence Code DIP28,.6
Seated Height-Max 5.1 mm
Standby Current-Max 0.002 A
Supply Current-Max 0.08 mA
Terminal Pitch 2.54 mm
Width 15.24 mm

Compare DS1230W-100-IND with alternatives

Compare U631H256D1K35G1 with alternatives