DS1230W-100-IND
vs
HM65256BLSP-20
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
RENESAS TECHNOLOGY CORP
|
| Part Package Code |
MODULE
|
DIP
|
| Package Description |
,
|
DIP,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
compliant
|
unknown
|
| Access Time-Max |
100 ns
|
200 ns
|
| JESD-30 Code |
R-XDMA-T28
|
R-PDIP-T28
|
| JESD-609 Code |
e0
|
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
NON-VOLATILE SRAM MODULE
|
PSEUDO STATIC RAM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Number of Words |
32768 words
|
32768 words
|
| Number of Words Code |
32000
|
32000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
32KX8
|
32KX8
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
MOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
3
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.41
|
| Additional Feature |
|
ACCESS TIME IN STATIC COLUMN MODE =100NS
|
| Length |
|
36 mm
|
| Package Code |
|
DIP
|
| Seated Height-Max |
|
5.08 mm
|
| Terminal Pitch |
|
2.54 mm
|
| Width |
|
7.62 mm
|
|
|
|
Compare DS1230W-100-IND with alternatives
Compare HM65256BLSP-20 with alternatives