DS1100M-60+
vs
DS1100M-25
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
ROCHESTER ELECTRONICS INC
DALLAS SEMICONDUCTOR
Part Package Code
DIP
Package Description
DIP,
0.300 INCH, DIP-8
Pin Count
8
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e3
Length
9.375 mm
Logic IC Type
SILICON DELAY LINE
SILICON DELAY LINE
Moisture Sensitivity Level
NOT SPECIFIED
Number of Functions
1
1
Number of Taps/Steps
5
5
Number of Terminals
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Impedance-Nom (Z0)
50 Ω
50 Ω
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Programmable Delay Line
NO
NO
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
4.572 mm
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Total Delay-Nom (td)
60 ns
25 ns
Width
7.62 mm
Base Number Matches
2
3
Package Equivalence Code
DIP8(UNSPEC)