DS1100M-60+
vs
DS1100M-25
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
DALLAS SEMICONDUCTOR
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP,
|
0.300 INCH, DIP-8
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e3
|
|
| Length |
9.375 mm
|
|
| Logic IC Type |
SILICON DELAY LINE
|
SILICON DELAY LINE
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Functions |
1
|
1
|
| Number of Taps/Steps |
5
|
5
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Impedance-Nom (Z0) |
50 Ω
|
50 Ω
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Programmable Delay Line |
NO
|
NO
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
4.572 mm
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Total Delay-Nom (td) |
60 ns
|
25 ns
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
3
|
| Package Equivalence Code |
|
DIP8(UNSPEC)
|
|
|
|