DS1023-200
vs
DS1023S-25+T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
DALLAS SEMICONDUCTOR
MAXIM INTEGRATED PRODUCTS INC
Package Description
0.300 INCH, DIP-16
0.300 INCH, SOIC-16
Reach Compliance Code
unknown
compliant
Family
CMOS/TTL
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
JESD-609 Code
e0
e3
Logic IC Type
SILICON DELAY LINE
SILICON DELAY LINE
Number of Functions
1
1
Number of Taps/Steps
255
255
Number of Terminals
16
16
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP16,.3
SOP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Power Supply Current-Max (ICC)
60 mA
60 mA
Programmable Delay Line
YES
YES
Prop. Delay@Nom-Sup
527 ns
80 ns
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Total Delay-Nom (td)
524 ns
76 ns
Base Number Matches
3
2
Pbfree Code
Part Package Code
SOIC
Pin Count
16
ECCN Code
EAR99
HTS Code
8542.39.00.01
Length
10.3 mm
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Seated Height-Max
2.65 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
7.5 mm
Compare DS1023S-25+T with alternatives