DS1020
vs
DS1023S-100+T
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
DALLAS SEMICONDUCTOR
|
MAXIM INTEGRATED PRODUCTS INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| Family |
1000
|
CMOS/TTL
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| Logic IC Type |
SILICON DELAY LINE
|
SILICON DELAY LINE
|
| Number of Functions |
1
|
1
|
| Number of Taps/Steps |
255
|
255
|
| Number of Terminals |
16
|
16
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Programmable Delay Line |
YES
|
YES
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
SOP, SOP16,.3
|
| Pin Count |
|
16
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| JESD-609 Code |
|
e3
|
| Length |
|
10.3 mm
|
| Moisture Sensitivity Level |
|
1
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Equivalence Code |
|
SOP16,.3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Supply Current-Max (ICC) |
|
60 mA
|
| Prop. Delay@Nom-Sup |
|
272 ns
|
| Seated Height-Max |
|
2.65 mm
|
| Supply Voltage-Max (Vsup) |
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
|
4.75 V
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Pitch |
|
1.27 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Total Delay-Nom (td) |
|
268 ns
|
| Width |
|
7.5 mm
|
|
|
|
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