DS1010{DIE}-175
vs
DS1010-450
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
DALLAS SEMICONDUCTOR
Part Package Code
DIE
Package Description
DIE,
0.300 INCH, DIP-14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Additional Feature
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT
Family
CMOS/TTL
CMOS/TTL
JESD-30 Code
X-XUUC-N
R-PDIP-T14
JESD-609 Code
e0
e0
Logic IC Type
SILICON DELAY LINE
SILICON DELAY LINE
Number of Functions
1
1
Number of Taps/Steps
10
10
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
DIP
Package Equivalence Code
DIE OR CHIP
DIP14,.3
Package Shape
UNSPECIFIED
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Programmable Delay Line
NO
NO
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Total Delay-Nom (td)
175 ns
450 ns
Base Number Matches
1
2
Number of Terminals
14
Power Supply Current-Max (ICC)
75 mA
Prop. Delay@Nom-Sup
450 ns
Terminal Pitch
2.54 mm
Compare DS1010{DIE}-175 with alternatives