DS1005M-175+
vs
DS1005M-175
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
DIP
DIP
Package Description
0.300 INCH, LOW PROFILE, DIP-8
0.300 INCH, LOW PROFILE, DIP-8
Pin Count
8
8
Reach Compliance Code
compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Additional Feature
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT
Family
CMOS/TTL
CMOS/TTL
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e3
e0
Length
9.375 mm
9.375 mm
Logic IC Type
SILICON DELAY LINE
SILICON DELAY LINE
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Taps/Steps
5
5
Number of Terminals
8
8
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
75 mA
75 mA
Programmable Delay Line
NO
NO
Prop. Delay@Nom-Sup
175 ns
175 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.572 mm
4.572 mm
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
MATTE TIN
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Total Delay-Nom (td)
175 ns
175 ns
Width
7.62 mm
7.62 mm
Base Number Matches
2
2