DS1000K-200
vs
DS1000K-200
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
DALLAS SEMICONDUCTOR
|
| Package Description |
DIP-14
|
DIP-8
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
4 Weeks
|
|
| JESD-30 Code |
R-XDIP-T14
|
R-PDIP-T8
|
| JESD-609 Code |
e0
|
e0
|
| Number of Functions |
1
|
1
|
| Number of Taps/Steps |
5
|
5
|
| Number of Terminals |
14
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Power Supply Current-Max (ICC) |
75 mA
|
75 mA
|
| Programmable Delay Line |
NO
|
NO
|
| Prop. Delay@Nom-Sup |
200 ns
|
200 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
BOTH LEADING & TRAILING EDGE ACCURACY; MAX FAN OUT OF 10 74LS LOAD PER OUTPUT
|
| Family |
|
CMOS/TTL
|
| Logic IC Type |
|
SILICON DELAY LINE
|
| Output Polarity |
|
TRUE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Supply Voltage-Max (Vsup) |
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
|
4.75 V
|
| Total Delay-Nom (td) |
|
200 ns
|
|
|
|