DPZ4MW16NJ3-10M
vs
DPZ4MW16NJ3-10B
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
DPAC TECHNOLOGIES CORP
|
DPAC TECHNOLOGIES CORP
|
Part Package Code |
LCC
|
LCC
|
Package Description |
MODULE, HERMETIC SEALED, J LEAD, SLCC-48
|
MODULE, HERMETIC SEALED, J LEAD, SLCC-48
|
Pin Count |
48
|
48
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
Access Time-Max |
100 ns
|
100 ns
|
Additional Feature |
AUTOMATIC WRITE
|
AUTOMATIC WRITE
|
JESD-30 Code |
R-CQCC-J48
|
R-CQCC-J48
|
Memory Density |
67108864 bit
|
67108864 bit
|
Memory IC Type |
FLASH MODULE
|
FLASH MODULE
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
48
|
48
|
Number of Words |
4194304 words
|
4194304 words
|
Number of Words Code |
4000000
|
4000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
4MX16
|
4MX16
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
AQCCJ
|
AQCCJ
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, PIGGYBACK
|
CHIP CARRIER, PIGGYBACK
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
12 V
|
12 V
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
19.431 mm
|
19.431 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
MOS
|
MOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Type |
NOR TYPE
|
NOR TYPE
|
Base Number Matches |
1
|
1
|
|
|
|
Compare DPZ4MW16NJ3-10M with alternatives
Compare DPZ4MW16NJ3-10B with alternatives