DPZ128X32VS-25M
vs
DPZ128X32VSP-25M
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Contact Manufacturer
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
TWILIGHT TECHNOLOGY INC
Part Package Code
PGA
PGA
Package Description
PGA, PGA66,11X11
CERAMIC, PGA-66
Pin Count
66
66
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
250 ns
250 ns
Additional Feature
USER CONFIGURABLE AS 128K X 32
USER CONFIGURABLE AS 128K X 32
Alternate Memory Width
16
8
Data Polling
NO
JESD-30 Code
S-CPGA-P66
S-CPGA-P66
JESD-609 Code
e0
Memory Density
4194304 bit
4194304 bit
Memory IC Type
FLASH MODULE
FLASH MODULE
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
66
66
Number of Words
524288 words
262144 words
Number of Words Code
512000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
512KX8
256K16
Output Characteristics
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Equivalence Code
PGA66,11X11
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
7.62 mm
8.382 mm
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Toggle Bit
NO
Type
NOR TYPE
NOR TYPE
Base Number Matches
2
2
Pbfree Code
Length
27.3 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
27.3 mm
Compare DPZ128X32VS-25M with alternatives
Compare DPZ128X32VSP-25M with alternatives