DPSD128MX4WNY5-DP-XXN12
vs
K4H510438B-NCB00
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
SAMSUNG SEMICONDUCTOR INC
Part Package Code
TSOP2
TSOP2
Package Description
ATSOP,
TSSOP,
Pin Count
54
54
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PDSO-G54
R-PDSO-G54
Memory Density
536870912 bit
536870912 bit
Memory IC Type
SYNCHRONOUS DRAM
DDR1 DRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
54
54
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
128MX4
128MX4
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
ATSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, PIGGYBACK, THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.59 mm
1.2 mm
Self Refresh
YES
YES
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.4 mm
Terminal Position
DUAL
DUAL
Base Number Matches
1
1
Rohs Code
Access Time-Max
0.75 ns
JESD-609 Code
e0
Length
11.2 mm
Operating Temperature-Max
70 °C
Operating Temperature-Min
Supply Voltage-Max (Vsup)
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Width
10.16 mm
Compare DPSD128MX4WNY5-DP-XXN12 with alternatives
Compare K4H510438B-NCB00 with alternatives