DPS512X16BA3-35I
vs
DPS1MS8AA3-85M
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
DPAC TECHNOLOGIES CORP
Part Package Code
PGA
PGA
Package Description
APGA,
APGA,
Pin Count
50
50
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
85 ns
Additional Feature
USER CONFIGURABLE AS 512K X 16
JESD-30 Code
R-CPGA-P50
R-CPGA-P50
Length
25.146 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
50
50
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
1MX8
1MX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
APGA
APGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, PIGGYBACK
GRID ARRAY, PIGGYBACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
21.0312 mm
Standby Voltage-Min
2 V
2 V
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
13.716 mm
Base Number Matches
1
1
Compare DPS512X16BA3-35I with alternatives
Compare DPS1MS8AA3-85M with alternatives