DPS512S8BN-55C vs DPS512S8BN-55M feature comparison

DPS512S8BN-55C B&B Electronics Manufacturing Company

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DPS512S8BN-55M Twilight Technology Inc

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Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer DPAC TECHNOLOGIES CORP TWILIGHT TECHNOLOGY INC
Part Package Code MODULE MODULE
Package Description , ,
Pin Count 32 32
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 55 ns
JESD-30 Code R-CDMA-T32 R-CDMA-T32
Memory Density 4194304 bit 4194304 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 32 32
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8 512KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Voltage-Min 2 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 2
Pbfree Code No
Rohs Code No
Length 42.164 mm
Package Code DIP
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Current-Max 0.235 mA
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

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