DPS512S8BN-35I
vs
WMS512K8-35CQA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
MERCURY SYSTEMS INC
Part Package Code
MODULE
Package Description
,
DIP,
Pin Count
32
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
35 ns
JESD-30 Code
R-CDMA-T32
R-CDIP-T32
Memory Density
4194304 bit
4194304 bit
Memory IC Type
SRAM MODULE
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
32
32
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
512KX8
512KX8
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Voltage-Min
2 V
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
Base Number Matches
2
3
Rohs Code
Additional Feature
LG-MAX
Length
42.2 mm
Package Code
DIP
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
MIL-STD-883
Seated Height-Max
5.13 mm
Supply Current-Max
0.16 mA
Terminal Pitch
2.5 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
Compare DPS512S8BN-35I with alternatives
Compare WMS512K8-35CQA with alternatives