DPS256X32V3-15M
vs
WS256K32L-35HMA
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
WHITE MICROELECTRONICS
Part Package Code
PGA
Package Description
PGA, PGA66,11X11
CERAMIC, HIP-66
Pin Count
66
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
150 ns
35 ns
Additional Feature
USER CONFIGURABLE AS 1M X 8
Alternate Memory Width
16
16
I/O Type
COMMON
JESD-30 Code
S-CPGA-P66
S-CHIP-P66
JESD-609 Code
e0
Memory Density
8388608 bit
8388608 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
Number of Terminals
66
66
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
256KX32
256KX32
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
Package Equivalence Code
PGA66,11X11
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
10.16 mm
Standby Current-Max
0.0028 A
Standby Voltage-Min
2 V
Supply Current-Max
0.325 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
Terminal Position
PERPENDICULAR
HEX
Base Number Matches
2
2
Screening Level
MIL-STD-883
Compare DPS256X32V3-15M with alternatives
Compare WS256K32L-35HMA with alternatives