DPS256X32BV3-30I
vs
DPS256X32CV3-30I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Contact Manufacturer
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
TWILIGHT TECHNOLOGY INC
Part Package Code
PGA
PGA
Package Description
PGA,
PGA,
Pin Count
66
66
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
30 ns
30 ns
Alternate Memory Width
16
16
JESD-30 Code
S-CPGA-P66
S-CPGA-P66
Memory Density
8388608 bit
8388608 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
Number of Terminals
66
66
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX32
256KX32
Output Characteristics
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
PGA
PGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
10.16 mm
10.16 mm
Standby Voltage-Min
2 V
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Base Number Matches
2
2
Pbfree Code
Rohs Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare DPS256X32BV3-30I with alternatives
Compare DPS256X32CV3-30I with alternatives