DPS256X16AA3-45C
vs
DPS256X16A3-70C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
DPAC TECHNOLOGIES CORP
Part Package Code
PGA
PGA
Package Description
APGA, PGA50,5X10
APGA, PGA50,5X10
Pin Count
50
50
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
45 ns
70 ns
Alternate Memory Width
8
I/O Type
COMMON
COMMON
JESD-30 Code
R-CPGA-P50
R-CPGA-P50
JESD-609 Code
e0
e0
Memory Density
4194304 bit
4194304 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
16
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
50
50
Number of Words
262144 words
524288 words
Number of Words Code
256000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX16
512KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
APGA
APGA
Package Equivalence Code
PGA50,5X10
PGA50,5X10
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, PIGGYBACK
GRID ARRAY, PIGGYBACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Voltage-Min
2 V
2 V
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Base Number Matches
2
2
Additional Feature
USER CONFIGURABLE AS 256K X 16
Length
25.146 mm
Seated Height-Max
21.0312 mm
Standby Current-Max
0.00018 A
Supply Current-Max
0.145 mA
Width
13.716 mm
Compare DPS256X16AA3-45C with alternatives
Compare DPS256X16A3-70C with alternatives