DPS256X16A3-12M vs DPS256X16A3-12C feature comparison

DPS256X16A3-12M B&B Electronics Manufacturing Company

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DPS256X16A3-12C B&B Electronics Manufacturing Company

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Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer DPAC TECHNOLOGIES CORP DPAC TECHNOLOGIES CORP
Part Package Code PGA PGA
Package Description APGA, PGA50,5X10 APGA, PGA50,5X10
Pin Count 50 50
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 120 ns 120 ns
Additional Feature USER CONFIGURABLE AS 256K X 16 USER CONFIGURABLE AS 256K X 16
I/O Type COMMON COMMON
JESD-30 Code R-CPGA-P50 R-CPGA-P50
JESD-609 Code e0 e0
Length 25.146 mm 25.146 mm
Memory Density 4194304 bit 4194304 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 50 50
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 512KX8 512KX8
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code APGA APGA
Package Equivalence Code PGA50,5X10 PGA50,5X10
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, PIGGYBACK GRID ARRAY, PIGGYBACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 21.0312 mm 21.0312 mm
Standby Current-Max 0.0014 A 0.00018 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.17 mA 0.145 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Width 13.716 mm 13.716 mm
Base Number Matches 2 2

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