DPS1MX8MKN3-30I
vs
WS1M8V-35CIA
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Transferred
Ihs Manufacturer
TWILIGHT TECHNOLOGY INC
WHITE ELECTRONIC DESIGNS CORP
Part Package Code
MODULE
Package Description
DIP, DIP32,.6
0.600 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-32
Pin Count
32
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
30 ns
35 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-CDMA-T32
R-CDIP-T32
Memory Density
8388608 bit
8388608 bit
Memory IC Type
SRAM MODULE
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1MX8
1MX8
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP32,.6
DIP32,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.0016 A
0.03 A
Standby Voltage-Min
2 V
3 V
Supply Current-Max
0.24 mA
0.16 mA
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
4.5 V
3 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Base Number Matches
2
3
JESD-609 Code
e0
Length
42.4 mm
Seated Height-Max
5.13 mm
Terminal Finish
TIN LEAD
Width
15.24 mm
Compare DPS1MX8MKN3-30I with alternatives