DPS1MX8MKN3-25I vs DPS1MS8EJ4-25C feature comparison

DPS1MX8MKN3-25I B&B Electronics Manufacturing Company

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DPS1MS8EJ4-25C B&B Electronics Manufacturing Company

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer DPAC TECHNOLOGIES CORP DPAC TECHNOLOGIES CORP
Part Package Code MODULE
Package Description DIP, DIP32,.6 ,
Pin Count 32
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
I/O Type COMMON
JESD-30 Code R-CDMA-T32 R-XDMA-J32
JESD-609 Code e0
Memory Density 8388608 bit 8388608 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 32 32
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1MX8 1MX8
Output Characteristics 3-STATE 3-STATE
Output Enable NO NO
Package Body Material CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0016 A
Standby Voltage-Min 2 V 2 V
Supply Current-Max 0.24 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE J BEND
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1

Compare DPS1MX8MKN3-25I with alternatives

Compare DPS1MS8EJ4-25C with alternatives