DPS1MS8MP-70C
vs
EDI8F81027LP100B6C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
ELECTRONIC DESIGNS INC
Part Package Code
MODULE
Package Description
DIP, DIP32,.6
Pin Count
32
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Access Time-Max
70 ns
100 ns
Additional Feature
LOW POWER STANDBY MODE; TTL COMPATIBLE INPUTS/OUTPUTS
TTL COMPATIBLE INPUT OUTPUT
I/O Type
COMMON
JESD-30 Code
R-CDMA-T32
R-XDMA-T32
JESD-609 Code
e0
Memory Density
8388608 bit
8388608 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
32
32
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
1MX8
1MX8
Output Characteristics
3-STATE
Output Enable
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
DIP
DIP
Package Equivalence Code
DIP32,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.0001 A
Standby Voltage-Min
2 V
Supply Current-Max
0.1 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
3
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