DPS1MS8EL4-30CI vs DPS1MX8MKN3-30C feature comparison

DPS1MS8EL4-30CI B&B Electronics Manufacturing Company

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DPS1MX8MKN3-30C Twilight Technology Inc

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Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer DPAC TECHNOLOGIES CORP TWILIGHT TECHNOLOGY INC
Package Description , DIP, DIP32,.6
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 30 ns 30 ns
JESD-30 Code R-XDMA-L32 R-CDMA-T32
Memory Density 8388608 bit 8388608 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1
Number of Terminals 32 32
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 1MX8 1MX8
Output Characteristics 3-STATE 3-STATE
Output Enable NO
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Voltage-Min 2 V 2 V
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form L BEND THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 2
Pbfree Code No
Rohs Code No
Part Package Code MODULE
Pin Count 32
I/O Type COMMON
Package Code DIP
Package Equivalence Code DIP32,.6
Peak Reflow Temperature (Cel) NOT SPECIFIED
Standby Current-Max 0.0006 A
Supply Current-Max 0.23 mA
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare DPS1MX8MKN3-30C with alternatives