DPS128X8BA3-25C
vs
DPS128X8CA3-25I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
DPAC TECHNOLOGIES CORP
TWILIGHT TECHNOLOGY INC
Part Package Code
PGA
PGA
Package Description
APGA, PGA50,5X10
APGA, PGA50,5X10
Pin Count
50
50
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
25 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-CPGA-P50
R-CPGA-P50
JESD-609 Code
e0
Length
25.146 mm
25.146 mm
Memory Density
1048576 bit
1048576 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
50
50
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX8
128KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
APGA
APGA
Package Equivalence Code
PGA50,5X10
PGA50,5X10
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, PIGGYBACK
GRID ARRAY, PIGGYBACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.207 mm
5.207 mm
Standby Current-Max
0.00025 A
0.0004 A
Standby Voltage-Min
2 V
2 V
Supply Current-Max
0.14 mA
0.14 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
PIN/PEG
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
PERPENDICULAR
PERPENDICULAR
Width
13.716 mm
13.716 mm
Base Number Matches
1
1
Pbfree Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare DPS128X8BA3-25C with alternatives
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