DPS128X32XHP-25C vs 5962-9559514H9A feature comparison

DPS128X32XHP-25C B&B Electronics Manufacturing Company

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5962-9559514H9A Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer DPAC TECHNOLOGIES CORP MICROSEMI CORP
Package Description QFP, QFP68,1.1SQ,50 DIE,
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 35 ns
Additional Feature ALSO CAN BE CONFIGURABLE AS 256K X 16 OR 128K X 32
I/O Type COMMON
JESD-30 Code S-XQMA-G68 X-XUUC-N
JESD-609 Code e0 e0
Memory Density 4194304 bit 4194304 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 8 32
Number of Functions 1 1
Number of Terminals 68
Number of Words 524288 words 131072 words
Number of Words Code 512000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8 128KX32
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code QFP DIE
Package Equivalence Code QFP68,1.1SQ,50
Package Shape SQUARE UNSPECIFIED
Package Style MICROELECTRONIC ASSEMBLY UNCASED CHIP
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.16 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.64 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm
Terminal Position QUAD UPPER
Base Number Matches 2 1
Part Package Code DIE
Screening Level MIL-PRF-38534 Class H

Compare DPS128X32XHP-25C with alternatives

Compare 5962-9559514H9A with alternatives