DPS128X32XHP-25C vs 5962-9559503HYX feature comparison

DPS128X32XHP-25C B&B Electronics Manufacturing Company

Buy Now Datasheet

5962-9559503HYX Microsemi Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer DPAC TECHNOLOGIES CORP MICROSEMI CORP
Package Description QFP, QFP68,1.1SQ,50 QFF,
Reach Compliance Code unknown compliant
ECCN Code 3A991.B.2.A 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 100 ns
Additional Feature ALSO CAN BE CONFIGURABLE AS 256K X 16 OR 128K X 32 ALSO CONFIGURABLE AS 512K X 8
I/O Type COMMON
JESD-30 Code S-XQMA-G68 S-CQFP-F68
JESD-609 Code e0 e4
Memory Density 4194304 bit 4194304 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 8 32
Number of Functions 1 1
Number of Terminals 68 68
Number of Words 524288 words 131072 words
Number of Words Code 512000 128000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 512KX8 128KX32
Output Characteristics 3-STATE
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code QFP QFF
Package Equivalence Code QFP68,1.1SQ,50
Package Shape SQUARE SQUARE
Package Style MICROELECTRONIC ASSEMBLY FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.16 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.64 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb) GOLD
Terminal Form GULL WING FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Base Number Matches 2 1
Pbfree Code No
Part Package Code QFP
Pin Count 68
Alternate Memory Width 16
Length 39.6 mm
Screening Level MIL-STD-883
Seated Height-Max 3.56 mm
Width 39.6 mm

Compare DPS128X32XHP-25C with alternatives

Compare 5962-9559503HYX with alternatives