DPS1027-55B
vs
EDI8M1664C45C6C
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
DPAC TECHNOLOGIES CORP
|
ELECTRONIC DESIGNS INC
|
Package Description |
DIP, DIP40,.9
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.32.00.41
|
|
Access Time-Max |
55 ns
|
45 ns
|
Additional Feature |
CONFIGURABLE AS 64K X 16
|
|
Alternate Memory Width |
8
|
8
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-XDMA-T40
|
R-XDMA-T40
|
JESD-609 Code |
e0
|
|
Memory Density |
1048576 bit
|
1048576 bit
|
Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
Memory Width |
4
|
16
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
40
|
40
|
Number of Words |
262144 words
|
65536 words
|
Number of Words Code |
256000
|
64000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
256KX4
|
64KX16
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Enable |
NO
|
YES
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIP
|
|
Package Equivalence Code |
DIP40,.9
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B (Modified)
|
|
Standby Current-Max |
0.4 A
|
|
Standby Voltage-Min |
4.5 V
|
|
Supply Current-Max |
2.24 mA
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
1
|
|
|
|
Compare DPS1027-55B with alternatives
Compare EDI8M1664C45C6C with alternatives