DP8441VLJ-25 vs F82C212-12 feature comparison

DP8441VLJ-25 Texas Instruments

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F82C212-12 Chips And Technologies Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP CHIPS AND TECHNOLOGIES INC
Package Description QFP, QFP100,.7X.9
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 26
Boundary Scan NO
Clock Frequency-Max 25 MHz
External Data Bus Width
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e0 e0
Length 20 mm
Low Power Mode NO
Memory Organization 64M X 1
Number of Banks 4
Number of Terminals 100 100
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP QFP
Package Equivalence Code QFP100,.7X.9 QFP100,.7X1.0
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK FLATPACK
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3 mm
Supply Current-Max 260 mA
Supply Voltage-Max 5.25 V
Supply Voltage-Min 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.635 mm
Terminal Position QUAD QUAD
Width 14 mm
uPs/uCs/Peripheral ICs Type MEMORY CONTROLLER, DRAM MEMORY CONTROLLER, DRAM
Base Number Matches 2 2

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