DP8441VLJ-25
vs
F82C212-12
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
CHIPS AND TECHNOLOGIES INC
Package Description
QFP, QFP100,.7X.9
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
26
Boundary Scan
NO
Clock Frequency-Max
25 MHz
External Data Bus Width
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e0
e0
Length
20 mm
Low Power Mode
NO
Memory Organization
64M X 1
Number of Banks
4
Number of Terminals
100
100
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QFP
QFP
Package Equivalence Code
QFP100,.7X.9
QFP100,.7X1.0
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK
FLATPACK
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3 mm
Supply Current-Max
260 mA
Supply Voltage-Max
5.25 V
Supply Voltage-Min
4.75 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
QUAD
QUAD
Width
14 mm
uPs/uCs/Peripheral ICs Type
MEMORY CONTROLLER, DRAM
MEMORY CONTROLLER, DRAM
Base Number Matches
2
2
Compare DP8441VLJ-25 with alternatives
Compare F82C212-12 with alternatives