DP8408AN vs DP8409AN-2 feature comparison

DP8408AN National Semiconductor Corporation

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DP8409AN-2 National Semiconductor Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description 0.600 INCH, PLASTIC, DIP-48 DIP, DIP48,.6
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 16 18
Boundary Scan NO NO
External Data Bus Width
JESD-30 Code R-PDIP-T48 R-PDIP-T48
JESD-609 Code e0 e0
Length 61.38 mm 61.38 mm
Low Power Mode NO NO
Memory Organization 64K X 1 256K X 1
Number of Banks 4 4
Number of Terminals 48 48
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP48,.6 DIP48,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 285 mA 325 mA
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology MOS MOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MEMORY CONTROLLER, DRAM MEMORY CONTROLLER, DRAM
Base Number Matches 7 3

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